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Indian Journal of Public Health Research & Development
Year : 2017, Volume : 8, Issue : 4
First page : ( 1262) Last page : ( 1270)
Print ISSN : 0976-0245. Online ISSN : 0976-5506.
Article DOI : 10.5958/0976-5506.2017.00509.5

Designing of Lay-Out Optimization of Vlsi Devices and Interconnects In Deep Submicron Designs

Sivasankari S. A.1, Dhanasekaran D.2

1Research Scholar, ECE Department, Saveetha School of Engineering, Saveetha University, Thandalam, Chennai

2Professor, ECE Department, Saveetha School of Engineering, Saveetha University, Thandalam, Chennai

Online published on 16 January, 2018.

Abstract

Interconnect has happen to the dominating factor in the performance of determining circuit and dependability in the design of deep submicron designs. It is first discussed the patterns and challenges of interconnect design as the technology feature size quickly diminishes below 0.1 micron. At the point it is explained the regularly utilized interconnect models and an arrangement of interconnect design and optimization techniques for enhancing interconnect performance and reliability. At long last, the presentations are the comparisons of various optimization methods in terms of their efficiency and optimization results and demonstrate the impact of these enhancements. The output shows how the optimization carried over for DSM designs.

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Keywords

Interconnect, Delay, Submicron Optimization, Iterativesizing.

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